METEK KITAMURA CO., LTD.  
About the Company Product Information Research & Development Environmental Initiatives Contact
  HOME > Product Information      
Product Information
 
 Metek's Operations
  As a company primarily focused on plating of lead frames, electronic components, and related products under our commitment to placing the customer first, we remain dedicated to manufacturing by Certification of ISO 9001 registration
Certification of ISO 9001 registration
providing reliable products with a commitment to our motto of gQuality Firsth;
  producing superior products through our advanced manufacturing process; and
  preventing defective products and their reoccurrence.
 

 Plating Equipment in Our Kyoto Plant
 
Lead Frame Plating
  Hoop plating equipment Sheet plating equipment
   
Full silver plating  
Tip silver plating    
Spot silver plating    
Spot silver-solder plating    
Full copper plating    
 
Spot gold plating  
Spot silver plating    
 
Connector Plating
  Hoop plating equipment accommodating lead-free and reflow processing
   
Full tin plating  
   
 
Miscellaneous
  Barrel plating equipment Plating of prototypes and small parts
    Nickel plating, tin plating   Gold plating, silver plating, nickel plating, tin plating, tin-silver alloy plating, electroless gold plating, etc.
PAGETOP

 Product Information
 
 Hoop Plating (full & partial)
Hoop Plating (full & partial) This method is used to plate a length of coiled product. The continuous production process ensures consistent quality at low cost. The line design offers the advantage of enabling a variety of processes.

Plating Materials
Silver plating (full & partial), copper plating (full), tin plating, and others


 Sheet Plating (full & partial)
Sheet Plating (full & partial) Ideal for plating products cut into small frames, this method is capable of high-mix, small-lot production. It is also useful for processing products with uneven frames.

Plating Materials
Silver plating (full & partial), copper plating (full), tin plating, tin-bismuth alloy plating, tin-copper alloy plating, and others.


 Barrel Plating
Barrel Plating Barrel plating is used to process a wide variety of shaped parts such as terminals, frames, screws, caps, switches, and relay parts used in products such as televisions, PCs, and mobile telephones. Our experience and expertise also enable us to handle precision components.

Plating Materials
Gold plating, tin plating, tin-bismuth alloy plating, tin-copper alloy plating
 
PAGETOP
 
Product Information
Product Information
Types of Plating
The Plating Process
Glossary
HOME
Contact us
We welcome your inquiries by telephone.
TEL +81-75-661-4900 FAX +81-75-681-2039
Environmental Initiatives
Certification of ISO 14001 registration On May 24, 2002, we acquired certification of ISO 14001 registration. Head Office JQA-EN2396
Certification of ISO 9001 registration On June 26, 1998, we acquired certification of ISO 9001 registration. Head Office JQA-2432
 
  METEK KITAMURA CO., LTD.
1 Warata, Kamitoba, Minami-ku, Kyoto 601-8133, JAPAN
TEL +81-75-661-4900 FAX +81-75-681-2039
     
Site Map About this Site
Copyright c 2006 METEK KITAMURA CO.,Ltd. All rights reserved.