HOME > Product Information > The Plating Process       Here, we present a simplified explanation of the plating process using the example of hoop plating. Below is an outline of the hoop plating process. The red circles at both ends of the illustration represent a coiled, hoop-shaped product; this configuration allows for continuous plating from reel to reel. Flashing is installed between each process to prevent fluids from migrating from one process to the next.         Outline of hoop plating system Plating preprocessing This process takes place before the product is plated. In the general process, the fat removal process removes any traces of fats or oils that might remain on the surface of the product; and then, the product undergoes an activation process that washes the surface of the product and removes any oxides present. Additional steps include polishing and blasting processes.   Base plating   This plating step provides the base for pre-plating. In short, it eliminates the direct impact of material roughness and material components on the finish plating. In addition, the strike plating method offers exceptional adhesion to the material.   Finish plating   This finish plating is the actual desired plating surface. Functional plating applications such as lead frames, silver plating, gold plating, lead-free solder plating are used to improve conductivity and the soldering process. Spot plating and tip plating processes are intended for partial plating of a product.   Postprocessing   This process applies an antioxidant to prevent product deterioration. This process is required to ensure that plated products maintain their performance after being stored for an extended period. Moreover, reflow processing of the tin plating of lead-free solder plating, which is used to prevent whisker formation, is part of this process.   Drying   This final step ensures that any moisture remaining from previous processes is removed. Accurate control of the time and temperature is required to prevent problems such as staining that could occur during this step.   Product Information Types of Plating The Plating Process Glossary HOME     METEK KITAMURA CO., LTD. 1 Warata, Kamitoba, Minami-ku, Kyoto 601-8133, JAPAN TEL +81-75-661-4900 FAX +81-75-681-2039       Copyright c 2006 METEK KITAMURA CO.,Ltd. All rights reserved.