HOME > Research & Development         For consultations on prototypes or new technologies, please contact us by telephone or email. (person in charge: Ikeda) Tel: +81-75-661-4908 Fax: +81-75-661-5344  Research Theme    Ensuring rapid delivery with a seven-day process   As the number of small-lot, high-mix production lines for electronic components increases, demand is growing for systems to accommodate this trend. In response, we are focusing on research and putting it into practice in order to complete in seven days prototypes requiring partial plating of lead frames.  Plating of difficult materials   We are developing platings that can normally deposit metals on materials such as quartz, zircon, and glass, which do not readily accept plating. Increasing the adhesion of materials is possible by applying electroless nickel plating and electroless copper plating to inorganic materials with the use of a catalyst. We are developing plating methods with even stronger adhesive strengths.  Chromium-free plating of plastic   Currently, the plastic resins used in electroless plating are generally plated after surface modification with chromic acid. However, considering the environmental issues associated with the use of chromium, we are now developing a satisfactory plating method for plastic resins that does not use chromic acid.  Powder plating   The available applications for powder plating are expected to expand as a result of the added functionality arising from the use of minute particle powders (several 10 micron) in the plating process. At present, we are considering only tin plating, but we are also achieving satisfactory plating results without adhesion of powders. In the future, we intend to apply powder plating to other metals, and these applications are now in development.  Stainless steel electrochemical mirror surface polishing   A lustrous mirror surface can be obtained thanks to the electrochemical polishing of stainless steel. This method differs from the machine polishing method in that it provides a satisfactory smoothness with fewer surface impurities. The polished products are expected to be used in chemical plants and for medical equipment because the homogenized surface exhibits improved erosion resistance.  Metal thin film plating   This process forms a thin metal film by plating. Because this film is made entirely of metal, it offers excellent heat-resistance and chemical resistance, especially in comparison with products coated with evaporated films and the like.   Research & Development HOME     METEK KITAMURA CO., LTD. 1 Warata, Kamitoba, Minami-ku, Kyoto 601-8133, JAPAN TEL +81-75-661-4900 FAX +81-75-681-2039       Copyright c 2006 METEK KITAMURA CO.,Ltd. All rights reserved.