Equipment information | Leading company in plating process METEK

Hoop plating

It is a method of plating a series of rolled products.
The advantage of continuous production is that stable quality can be obtained at low cost, and the line design enables various processes.
Depending on the product shape, stripe plating and ring plating are also possible.

Specification

Shape	Reel-like product (Width: 15 to 65 mm, Thickness: 0.15 to 0.5 mm)※ This number changes depending on the material and product shape.
Material	Fe material (42 material, etc.), Cu material

Plating type

Ag plating	Partially Ag plating (base plating = Cu), whole surface Ag plating (base plating = Cu, Ni)
Tin plating	Entire surface Sn plating (Base plating = Cu, Ni), Partial Sn plating (Base plating = Ni, Cu)
Cu plating	Full Cu plating
Ni plating	Full surface Ni plating

Strip plating

By plating on products cut into small frames, it is possible to cope with products with many types and small lots and with steps in the frames.

Specification

Shape	Frame-like products (width: 15 to 65 mm, thickness: 0.15 to 0.5 mm) * These number changes depending on the material and product shape
Material	Fe material (SUS material, 42 material, etc.), Cu material

Plating type

Ag Plating	Spot Ag Plating (Base Plating = Cu)
Au plating	Spot Au plating

Barrel plating

Put the product in a container called a barrel and apply plating while rotating it in the plating solution.
It supports terminals, frames, screws, caps, switches and relay parts used in TVs, PCs and mobile phones.

Specification

Shape	Shape to fit into container, size not to pass through gap※ Except for products that are extremely deformed
Material	Material Fe material (SUS material, 42 material, etc.), Cu material

Plating type

Ag plating	Full surface Ag plating (Base plating = Cu)
Au plating	Full surface Au plating (Base plating = Ni)
Sn plating	Entire surface Sn plating (Base plating = Ni, Cu)

Inspection equipment introduction

X-ray fluorescence film thickness meter

Specification	FT150H (made by Hitachi High-Tech Science Co., Ltd.), top vertical irradiation method
Application	Measurement of plating thickness on metal material, simplified spectrum analysis (Qualitative analysis), measuring thin film plating of minute parts with high accuracy

X-ray fluorescence analyzer

Specification	SEA 1200 VX (made by SII Nano Technology Co., Ltd.)
Application	Measurement of elements contained in products

Micro-spectral colorimeter

Specification	VAA-400 (made by Nippon Denshoku Industries Co., Ltd.) all wavelength simultaneous compensation method
Application	Measurement of glossiness of plated surface, measurement of spectral reflectance and spectral transmittance

Image measuring instrument

Specification	QVH1-X302P1L-C (made by Mitutoyo Corporation), transmission and reflection type
Application	XYZ measurement, plating area automatic measurement, cut dimension automatic measurement

Solder checker

Specification	SAT-5100 (made by RHESCA Co., LTD.), measurement of buoyancy and surface tension
Application	Evaluation of solderability

Scanning electron microscope, energy dispersive X-ray analyzer

Specification	S-3400N (made by Hitachi High-Technologies Corporation), EMAX ENERGY EX-250 (made by Horiba, Ltd.)
Application	Enables observation of plated particles, analysis of defective products, observation at low to high magnifications, and elemental analysis with EDX

ICP emission analyzer

Specification	SPS3500 (made by Hitachi High-Technologies Corporation)
Application	Measurement of metal concentration in plating solution, measurement of impurities, measurement of metal concentration in drainage